Microstructure and mechanical properties of metastable solid solution copper‐tungsten films

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Thomas, K., Taylor, A. A., Raghavan, R., Chawla, V., Spolenak, R., & Michler, J. (2017). Microstructure and mechanical properties of metastable solid solution copper‐tungsten films. Thin Solid Films, 642, 82-89. https://doi.org/10.1016/j.tsf.2017.09.007