Thin layer Ag-Sn transient liquid phase bonding using magnetron sputtering for chip to baseplate bonding

Natzke P, Grossner U, Janczak-Rusch J & Jeurgens L
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Natzke, P., Grossner, U., Janczak-Rusch, J., & Jeurgens, L. (2017). Thin layer Ag-Sn transient liquid phase bonding using magnetron sputtering for chip to baseplate bonding. In 2017 IEEE 5th workshop on wide bandgap power devices and applications (WiPDA) (pp. 165-170). https://doi.org/10.1109/WiPDA.2017.8170541