Acceleration measurements during reactive bonding processes

Spies I, Schumacher A, Knappmann S, Rheingans B, Janczak-Rusch J & Jeurgens LPH
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Spies, I., Schumacher, A., Knappmann, S., Rheingans, B., Janczak-Rusch, J., & Jeurgens, L. P. H. (2018). Acceleration measurements during reactive bonding processes (p. (6 pp.). Presented at the EMPC 2017 - 21st European microelectronics packaging conference. https://doi.org/10.23919/EMPC.2017.8346881