Interfacial intermetallic growth and strength of composite lead-free solder alloy through isothermal aging

Sivasubramaniam V, Bosco NS, Janczak-Rusch J, Cugnoni J & Botsis J
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Sivasubramaniam, V., Bosco, N. S., Janczak-Rusch, J., Cugnoni, J., & Botsis, J. (2008). Interfacial intermetallic growth and strength of composite lead-free solder alloy through isothermal aging. Journal of Electronic Materials, 37(10), 1598-1604. https://doi.org/10.1007/s11664-008-0524-2