Three influential factors on colloidal nanoparticle deposition for heat conduction enhancement in 3D chip stacks

Qin F, Zhao J, Kang Q, Brunschwiler T, Carmeliet J & Derome D
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Qin, F., Zhao, J., Kang, Q., Brunschwiler, T., Carmeliet, J., & Derome, D. (2021). Three influential factors on colloidal nanoparticle deposition for heat conduction enhancement in 3D chip stacks. Applied Thermal Engineering, 187, 116585 (16 pp.). https://doi.org/10.1016/j.applthermaleng.2021.116585