Adhesion evaluation of thin films to dielectrics in multilayer stacks: a comparison of four-point bending and stressed overlayer technique.

Lassnig A, Putz B, Hirn S, Többens DM, Mitterer C & Cordill MJ
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Lassnig, A., Putz, B., Hirn, S., Többens, D. M., Mitterer, C., & Cordill, M. J. (2021). Adhesion evaluation of thin films to dielectrics in multilayer stacks: a comparison of four-point bending and stressed overlayer technique. Materials and Design, 200, 109451 (8 pp.). https://doi.org/10.1016/j.matdes.2021.109451