Intermetallic layer growth kinetics in Sn-Ag-Cu system using diffusion multiple and reflow techniques

Pawełkiewicz M, Danielewski M & Janczak-Rusch J
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Pawełkiewicz, M., Danielewski, M., & Janczak-Rusch, J. (2015). Intermetallic layer growth kinetics in Sn-Ag-Cu system using diffusion multiple and reflow techniques. Advanced Engineering Materials, 17(4), 512-522. https://doi.org/10.1002/adem.201400226