Effect of process and service conditions on TLP-bonded components with (Ag,Ni–)Sn interlayer combinations

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Lis, A., & Leinenbach, C. (2015). Effect of process and service conditions on TLP-bonded components with (Ag,Ni–)Sn interlayer combinations. Journal of Electronic Materials, 44(11), 4576-4588. https://doi.org/10.1007/s11664-015-3982-3