HRXRD and micro-CT multiscale investigation of stress and defects induced by a novel packaging design for MEMS sensors

Borzì A, Zboray R, Dolabella S, Brun S, Telmont F, Kupferschmied P, Le Néal J-F, Drljaca P, Fiorucci G, Dommann A & Neels A
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Borzì, A., Zboray, R., Dolabella, S., Brun, S., Telmont, F., Kupferschmied, P., … Neels, A. (2022). HRXRD and micro-CT multiscale investigation of stress and defects induced by a novel packaging design for MEMS sensors. Applied Materials Today, 29, 101555 (11 pp.). https://doi.org/10.1016/j.apmt.2022.101555