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  • (-) Organizational Unit = 405 Transport at Nanoscale Interfaces
  • (-) Publication Year = 2011 - 2011
  • (-) Keywords = cavitation
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Evolution of the microstructure of Sn-Ag-Cu solder joints exposed to ultrasonic waves during solidification
Chinnam, R. K., Fauteux, C., Neuenschwander, J., & Janczak-Rusch, J. (2011). Evolution of the microstructure of Sn-Ag-Cu solder joints exposed to ultrasonic waves during solidification. Acta Materialia, 59(4), 1474-1481. https://doi.org/10.1016/j.actamat.2010.11.011