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Effects of combining graphene nanoplatelet and phosphorous flame retardant as additives on mechanical properties and flame retardancy of epoxy nanocomposite
Netkueakul, W., Fischer, B., Walder, C., Nüesch, F., Rees, M., Jovic, M., … Wang, J. (2020). Effects of combining graphene nanoplatelet and phosphorous flame retardant as additives on mechanical properties and flame retardancy of epoxy nanocomposite. Polymers, 12(10), 2349 (19 pp.). https://doi.org/10.3390/polym12102349
ESD challenges on RFID devices
Jacob, P. (2019). ESD challenges on RFID devices. Electronic Device Failure Analysis, 21(4), 14-20.
Early life failures in automotive applications
Jacob, P. (2019). Early life failures in automotive applications. In T. Gandhi (Ed.), Microelectronics failure analysis desk reference (pp. 513-523). https://doi.org/10.31399/asm.tb.mfadr7.t91110513
Leitfähig-Ableitfähig-Isolierend: Was zur Vermeidung harter Entladungen von Bedeutung ist
Jacob, P. (2019). Leitfähig-Ableitfähig-Isolierend: Was zur Vermeidung harter Entladungen von Bedeutung ist. In A. Gottschalk (Ed.), Tagungsband 16. ESD-Forum 2019 (pp. 65-71). ESD Forum e.V.
Neue Messmethode zur ESD Risikoabschätzung in Bestückungsanlagen
Jacob, P. (2019). Neue Messmethode zur ESD Risikoabschätzung in Bestückungsanlagen. In A. Gottschalk (Ed.), Tagungsband 16. ESD-Forum 2019 (pp. 93-101). ESD Forum e.V.
New approaches in ESD risk measurement of PCB assembling machines and ESD countermeasures
Jacob, P. (2019). New approaches in ESD risk measurement of PCB assembling machines and ESD countermeasures. In International symposium on physical & failure analysis of integrated circuits. 2019 IEEE 26th international symposium on physical and failure analysis of integrated circuits (IPFA) (p. (6 pp.). https://doi.org/10.1109/IPFA47161.2019.8984855
Stress factors in aircraft electronics: superimpositions, case studies and failure precautions
Jacob, P., & Nicoletti, G. (2019). Stress factors in aircraft electronics: superimpositions, case studies and failure precautions. Microelectronics and Reliability, 100-101, 113315 (6 pp.). https://doi.org/10.1016/j.microrel.2019.06.007
Power device burned completely – and now, how to find the root cause?
Jacob, P. (2018). Power device burned completely – and now, how to find the root cause? In ISTFA 2018: proceedings from the 44th international symposium for testing and failure analysis (p. (6 pp.). ASM International.
A very unusual transistor failure, caused by a solenoid
Jacob, P., & Furrer, R. (2017). A very unusual transistor failure, caused by a solenoid. Microelectronics and Reliability, 76-77, 102-105. https://doi.org/10.1016/j.microrel.2017.06.058
New ESD challenges in RFID manufacturing
Jacob, P., & Thiemann, U. (2017). New ESD challenges in RFID manufacturing. Microelectronics and Reliability, 76-77, 395-399. https://doi.org/10.1016/j.microrel.2017.06.048
Early life field failures in modern automotive electronics – an overview; root causes and precautions
Jacob, P. (2016). Early life field failures in modern automotive electronics – an overview; root causes and precautions. Microelectronics and Reliability, 64, 79-83. https://doi.org/10.1016/j.microrel.2016.07.015
Failure mechanisms and precautions in plug connectors and relays
Jacob, P. (2016). Failure mechanisms and precautions in plug connectors and relays. Microelectronics and Reliability, 64, 693-698. https://doi.org/10.1016/j.microrel.2016.07.030
Recovering contacting interfaces in packaging and in semiconductor devices: mechanisms and how to handle them in analysis
Jacob, P., Pecnik, C., Nicoletti, G., & Broennimann, R. (2016). Recovering contacting interfaces in packaging and in semiconductor devices: mechanisms and how to handle them in analysis. In Proceedings of the 2016 IEEE 23rd international symposium on the physical and failure analysis of integrated circuits (IPFA) (pp. 326-331). https://doi.org/10.1109/IPFA.2016.7564310
Capacitors―the helpers of active devices: a failure analyst's (re)view
Jacob, P. (2015). Capacitors―the helpers of active devices: a failure analyst's (re)view. Electronic Device Failure Analysis, 17(4), 22-28.
Failure analysis and reliability on system level
Jacob, P. (2015). Failure analysis and reliability on system level. Microelectronics and Reliability, 55(9-10), 2154-2158. https://doi.org/10.1016/j.microrel.2015.06.022
Unusual defects, generated by wafer sawing: an update, including pick&place processing
Jacob, P. (2015). Unusual defects, generated by wafer sawing: an update, including pick&place processing. Microelectronics and Reliability, 55(9-10), 1826-1831. https://doi.org/10.1016/j.microrel.2015.06.124
Anamnesis in failure analysis - how a system-related approach can save failure analysis (FA) time, shorten learning loops and reduce cost
Jacob, P. (2013). Anamnesis in failure analysis - how a system-related approach can save failure analysis (FA) time, shorten learning loops and reduce cost. In Conference proceedings from the international symposium for testing and failure analysis (pp. 99-104). ASM International.
Die neue Richtlinie 1013 des ESD-Forums und erste Erfahrungen
Jacob, P. (2013). Die neue Richtlinie 1013 des ESD-Forums und erste Erfahrungen (p. (4 pp.). Presented at the 13. ESD-Forum 2013. .
ESD and/versus EOS―what's new about it?
Jacob, P. (2013). ESD and/versus EOS―what's new about it? Electronic Device Failure Analysis, 15(2), 4-13.
Failure causes generating aluminium protrusion/extrusion
Jacob, P., & Nicoletti, G. (2013). Failure causes generating aluminium protrusion/extrusion. Microelectronics and Reliability, 53(9-11), 1553-1557. https://doi.org/10.1016/j.microrel.2013.07.015