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Effect of internal stress on short-circuit diffusion in thin films and nanolaminates: application to Cu/W nano-multilayers
Druzhinin, A. V., Rheingans, B., Siol, S., Straumal, B. B., Janczak-Rusch, J., Jeurgens, L. P. H., & Cancellieri, C. (2020). Effect of internal stress on short-circuit diffusion in thin films and nanolaminates: application to Cu/W nano-multilayers. Applied Surface Science, 508, 145254 (9 pp.). https://doi.org/10.1016/j.apsusc.2020.145254
Tailoring fast directional mass transport of nano-confined Ag–Cu alloys upon heating: effect of the AlN barrier thickness
Araullo-Peters, V., Cancellieri, C., Chiodi, M., Janczak-Rusch, J., & Jeurgens, L. P. H. (2019). Tailoring fast directional mass transport of nano-confined Ag–Cu alloys upon heating: effect of the AlN barrier thickness. ACS Applied Materials and Interfaces, 11(6), 6605-6614. https://doi.org/10.1021/acsami.8b19091
Effect of the individual layer thickness on the transformation of Cu/W nano-multilayers into nanocomposites
Druzhinin, A. V., Ariosa, D., Siol, S., Ott, N., Straumal, B. B., Janczak-Rusch, J., … Cancellieri, C. (2019). Effect of the individual layer thickness on the transformation of Cu/W nano-multilayers into nanocomposites. Materialia, 7, 100400 (11 pp.). https://doi.org/10.1016/j.mtla.2019.100400
Joining technology innovations at the macro, micro, and nano levels
Hu, A., Janczak-Rusch, J., & Sano, T. (2019). Joining technology innovations at the macro, micro, and nano levels. Applied Sciences, 9(17), 3568 (9 pp.). https://doi.org/10.3390/app9173568
Joining with reactive nano-multilayers: influence of thermal properties of components on joint microstructure and mechanical performance
Rheingans, B., Spies, I., Schumacher, A., Knappmann, S., Furrer, R., Jeurgens, L. P. H., & Janczak-Rusch, J. (2019). Joining with reactive nano-multilayers: influence of thermal properties of components on joint microstructure and mechanical performance. Applied Sciences, 9(2), 262 (11 pp.). https://doi.org/10.3390/app9020262
Reaktive Nanomultischichten zum Löten ohne Ofen
Rheingans, B., Jeurgens, L. P. H., & Janczak-Rusch, J. (2019). Reaktive Nanomultischichten zum Löten ohne Ofen. Schweisstechnik, 108(02), 14-18.
Al-Si/AlN nanomultilayered systems with reduced melting point: experiments and simulations
Wejrzanowski, T., Lipecka, J., Janczak-Rusch, J., & Lewandowska, M. (2019). Al-Si/AlN nanomultilayered systems with reduced melting point: experiments and simulations. Applied Surface Science, 493, 261-270. https://doi.org/10.1016/j.apsusc.2019.07.045
Modeling of interface and internal disorder applied to XRD analysis of Ag-based nano-multilayers
Ariosa, D., Cancellieri, C., Araullo-Peters, V., Chiodi, M., Klyatskina, E., Janczak-Rusch, J., & Jeurgens, L. P. H. (2018). Modeling of interface and internal disorder applied to XRD analysis of Ag-based nano-multilayers. ACS Applied Materials and Interfaces, 10(24), 20938-20949. https://doi.org/10.1021/acsami.8b02653
Torsional shear strength of steel joined with high performance aerospace adhesives at cryogenic and elevated temperatures
Blugan, G., Mata-Osoro, G., Fecht, S., Janczak-Rusch, J., & Kuebler, J. (2018). Torsional shear strength of steel joined with high performance aerospace adhesives at cryogenic and elevated temperatures. PLoS One, 13(11), e0206981 (14 pp.). https://doi.org/10.1371/journal.pone.0206981
The effect of interfacial Ge and RF-Bias on the microstructure and stress evolution upon annealing of Ag/AlN multilayers
Cancellieri, C., Klyatskina, E., Chiodi, M., Janczak-Rusch, J., & Jeurgens, L. (2018). The effect of interfacial Ge and RF-Bias on the microstructure and stress evolution upon annealing of Ag/AlN multilayers. Applied Sciences, 8(12), 2403 (13 pp.). https://doi.org/10.3390/app8122403
Reactive joining of thermally and mechanically sensitive materials
Rheingans, B., Furrer, R., Neuenschwander, J., Spies, I., Schumacher, A., Knappmann, S., … Janczak-Rusch, J. (2018). Reactive joining of thermally and mechanically sensitive materials. Journal of Electronic Packaging, 140(4), 041006 (8 pp.). https://doi.org/10.1115/1.4040978
Acceleration measurements during reactive bonding processes
Spies, I., Schumacher, A., Knappmann, S., Rheingans, B., Janczak-Rusch, J., & Jeurgens, L. P. H. (2018). Acceleration measurements during reactive bonding processes (p. (6 pp.). Presented at the EMPC 2017 - 21st European microelectronics packaging conference. https://doi.org/10.23919/EMPC.2017.8346881
Reactive joining of sensitive materials for MEMS devices: characterization of joint quality
Spies, I., Schumacher, A., Knappmann, S., Dehé, A., Rheingans, B., Furrer, R., … Jeurgens, L. P. H. (2018). Reactive joining of sensitive materials for MEMS devices: characterization of joint quality. In Proceedings smart systems integration 2018. International conference & exhibition on integration issues of miniaturized systems- MEMS, NEMS, ICs and electronic components (p. (6 pp.). Fraunhofer Institute for Electronic Nano Systems.
Kinetic pinning versus capillary pinning of voids at the moving interface during reactive diffusion
Gusak, A., Zaporozhets, T., & Janczak-Rusch, J. (2017). Kinetic pinning versus capillary pinning of voids at the moving interface during reactive diffusion. Philosophical Magazine Letters, 97(1), 1-10. https://doi.org/10.1080/09500839.2016.1262559
Validation of an embedded-atom copper classical potential via bulk and nanostructure simulations
Kozlowski, M., Scopece, D., Janczak-Rusch, J., Jeurgens, L. P. H., Kozubski, R., & Passerone, D. (2017). Validation of an embedded-atom copper classical potential via bulk and nanostructure simulations. In R. Kozubski (Ed.), Diffusion foundations: Vol. 12. Multiscale modelling of diffusion – controlled phenomena in condensed matter (pp. 74-92). https://doi.org/10.4028/www.scientific.net/DF.12.74
Thermal stability of Al-Si<SUB>12at.%</SUB> nano-alloys confined between AlN layers in a nanomultilayer configuration
Lipecka, J., Janczak-Rusch, J., Lewandowska, M., Andrzejczuk, M., Richter, G., & Jeurgens, L. P. H. (2017). Thermal stability of Al-Si12at.% nano-alloys confined between AlN layers in a nanomultilayer configuration. Scripta Materialia, 130, 210-213. https://doi.org/10.1016/j.scriptamat.2016.12.016
Mechanical behavior of SiC joints brazed using an active Ag-Cu-In-Ti braze at elevated temperatures
Moszner, F., Mata-Osoro, G., Chiodi, M., Janczak-Rusch, J., Blugan, G., & Kuebler, J. (2017). Mechanical behavior of SiC joints brazed using an active Ag-Cu-In-Ti braze at elevated temperatures. International Journal of Applied Ceramic Technology, 14, 703-711. https://doi.org/10.1111/ijac.12689
Thin layer Ag-Sn transient liquid phase bonding using magnetron sputtering for chip to baseplate bonding
Natzke, P., Grossner, U., Janczak-Rusch, J., & Jeurgens, L. (2017). Thin layer Ag-Sn transient liquid phase bonding using magnetron sputtering for chip to baseplate bonding. In 2017 IEEE 5th workshop on wide bandgap power devices and applications (WiPDA) (pp. 165-170). https://doi.org/10.1109/WiPDA.2017.8170541
The effect of thermal treatment on the stress state and evolving microstructure of Cu/W nano-multilayers
Cancellieri, C., Moszner, F., Chiodi, M., Yoon, S., Janczak-Rusch, J., & Jeurgens, L. P. H. (2016). The effect of thermal treatment on the stress state and evolving microstructure of Cu/W nano-multilayers. Journal of Applied Physics, 120(19), 195107 (9 pp.). https://doi.org/10.1063/1.4967992
Massive Ag migration through metal/ceramic nano-multilayers: an interplay between temperature, stress-relaxation and oxygen-enhanced mass transport
Chiodi, M., Cancellieri, C., Moszner, F., Mariusz Andrzejczuk, M., Janczak-Rusch, J., & Jeurgens, L. P. H. (2016). Massive Ag migration through metal/ceramic nano-multilayers: an interplay between temperature, stress-relaxation and oxygen-enhanced mass transport. Journal of Materials Chemistry C, 4(22), 4927-4938. https://doi.org/10.1039/c6tc01098a
 

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