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Composition dependent electrical transport in Si<sub>1−x</sub>Ge<sub>x</sub> nanosheets with monolithic single-elementary Al contacts
Wind, L., Sistani, M., Böckle, R., Smoliner, J., Vukŭsić, L., Aberl, J., … Weber, W. M. (2022). Composition dependent electrical transport in Si1−xGex nanosheets with monolithic single-elementary Al contacts. Small, 18(44), 2204178 (9 pp.). https://doi.org/10.1002/smll.202204178
Monolithic and single-crystalline aluminum-silicon heterostructures
Wind, L., Böckle, R., Sistani, M., Schweizer, P., Maeder, X., Michler, J., … Weber, W. M. (2022). Monolithic and single-crystalline aluminum-silicon heterostructures. ACS Applied Materials and Interfaces, 14(22), 26238-26244. https://doi.org/10.1021/acsami.2c04599
Size-dependent plasticity and activation parameters of lithographically-produced silicon micropillars
Chen, M., Wehrs, J., Sologubenko, A. S., Rabier, J., Michler, J., & Wheeler, J. M. (2020). Size-dependent plasticity and activation parameters of lithographically-produced silicon micropillars. Materials and Design, 189, 108506 (13 pp.). https://doi.org/10.1016/j.matdes.2020.108506
Fracture of silicon: influence of rate, positioning accuracy, FIB machining, and elevated temperatures on toughness measured by pillar indentation splitting
Lauener, C. M., Petho, L., Chen, M., Xiao, Y., Michler, J., & Wheeler, J. M. (2018). Fracture of silicon: influence of rate, positioning accuracy, FIB machining, and elevated temperatures on toughness measured by pillar indentation splitting. Materials and Design, 142, 340-349. https://doi.org/10.1016/j.matdes.2018.01.015
A new push-pull sample design for microscale mode 1 fracture toughness measurements under uniaxial tension
Schwiedrzik, J. J., Ast, J., Pethö, L., Maeder, X., & Michler, J. (2018). A new push-pull sample design for microscale mode 1 fracture toughness measurements under uniaxial tension. Fatigue and Fracture of Engineering Materials and Structures, 41(5), 991-1001. https://doi.org/10.1111/ffe.12741
Silicon micropillars: high stress plasticity
Rabier, J., Montagne, A., Wheeler, J. M., Demenet, J. L., Michler, J., & Ghisleni, R. (2013). Silicon micropillars: high stress plasticity. Physica Status Solidi C: Current Topics in Solid State Physics, 10(1), 11-15. https://doi.org/10.1002/pssc.201200546
Electrodeposition of amorphous silicon in non-oxygenated organic solvent
Bechelany, M., Elias, J., Brodard, P., Michler, J., & Philippe, L. (2012). Electrodeposition of amorphous silicon in non-oxygenated organic solvent. Thin Solid Films, 520(6), 1895-1901. https://doi.org/10.1016/j.tsf.2011.09.026
Applications of colloidal crystal patterning for synthesis of 1D and 3D nanostructured semiconductors
Lévy-Clément, C., Wang, X., Benoit-Moez, C., Elias, J., Philippe, L., & Michler, J. (2011). Applications of colloidal crystal patterning for synthesis of 1D and 3D nanostructured semiconductors. Physica Status Solidi A: Applications and Materials, 208(6), 1426-1432. https://doi.org/10.1002/pssa.201000179
Microstructure and lattice bending in polycrystalline laser-crystallized silicon thin films for photovoltaic applications
Maeder, X., Niederberger, C., Christiansen, S., Bochmann, A., Andrä, G., Gawlik, A., … Michler, J. (2010). Microstructure and lattice bending in polycrystalline laser-crystallized silicon thin films for photovoltaic applications. Thin Solid Films, 519(1), 58-63. https://doi.org/10.1016/j.tsf.2010.07.058
Nanowires enabling signal-enhanced nanoscale Raman spectroscopy
Becker, M., Sivakov, V., Gösele, U., Stelzner, T., Andrä, G., Reich, H. J., … Christiansen, S. H. (2008). Nanowires enabling signal-enhanced nanoscale Raman spectroscopy. Small, 4(4), 398-404. https://doi.org/10.1002/smll.200701007
Towards the correlation of mechanical properties and sawing parameters of silicon wafers
Bidiville, A., Wasmer, K., Michler, J., Ballif, C., Van der Meer, M., & Nasch, P. M. (2008). Towards the correlation of mechanical properties and sawing parameters of silicon wafers. In Proceedings of the 22nd European photovoltaic solar energy conference (pp. 1130-1134).