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Draw-spun, photonically annealed Ag fibers as alternative electrodes for flexible CIGS solar cells
Liu, Y., Zeder, S., Lin, S., Carron, R., Grossmann, G., Bolat, S., … Romanyuk, Y. E. (2019). Draw-spun, photonically annealed Ag fibers as alternative electrodes for flexible CIGS solar cells. Science and Technology of Advanced Materials, 20(1), 26-34. https://doi.org/10.1080/14686996.2018.1552480
Grundlagen des Reflowlötens. Teil 4: Konsequenzen der fortlaufenden Miniaturisierung
Bell, H., Grossmann, G., Hippin, C., Lange, B., Wohlrabe, H., & Öttl, H. (2018). Grundlagen des Reflowlötens. Teil 4: Konsequenzen der fortlaufenden Miniaturisierung. Reflow Technologie. Blaubeuren-Seissen: Rehm Thermal Systems GmbH.
Lead free BGAs soldered with SnPb36Ag2 solder
Grossmann, G., & Nicoletti, G. (2015). Lead free BGAs soldered with SnPb36Ag2 solder. Materials Transactions, 56(7), 988-991. https://doi.org/10.2320/matertrans.MI201409
Grundlagen des Reflowlötens. Teil 3: Zuverlässigkeit und Fehlermanagement
Bell, H., Grossmann, G., & Wohlrabe, H. (2012). Grundlagen des Reflowlötens. Teil 3: Zuverlässigkeit und Fehlermanagement. Reflow Technologie. Blaubeuren-Seissen: Rehm Thermal Systems GmbH.
Measurement method for the assessment of the energy consumption of cooking setups
Grossmann, G., & Weiss, C. (2011). Measurement method for the assessment of the energy consumption of cooking setups. Journal of Testing and Evaluation, 39(3), 431-435. https://doi.org/10.1520/JTE102997
The ELFNET book on failure mechanisms, testing methods, and quality issues of lead-free solder interconnects
Grossmann, G., & Zardini, C. (Eds.). (2011). The ELFNET book on failure mechanisms, testing methods, and quality issues of lead-free solder interconnects. https://doi.org/10.1007/978-0-85729-236-0
Fundamentals of Reflow Soldering. Part 1: fundamentals of materials technology in the field of soldering
Bell, H., & Grossmann, G. (2009). Fundamentals of Reflow Soldering. Part 1: fundamentals of materials technology in the field of soldering. Reflow Technology. Blaubeuren-Seissen: Rehm Thermal Systems GmbH.
Исследование микроструктуры паяных соединений бессвинцовых BGA-компонентов, монтированных припоем олово–свинец
Grossmann, G., & Novikov, A. (2008). Исследование микроструктуры паяных соединений бессвинцовых BGA-компонентов, монтированных припоем олово–свинец. Technologies in Electronic Industry (Moscow), (2), 54-60.
Local fatigue in lead-free SnAg3.8Cu0.7 solder
Jud, P. P., Grossmann, G., Sennhauser, U., & Uggowitzer, P. J. (2006). Local fatigue in lead-free SnAg3.8Cu0.7 solder. Advanced Engineering Materials, 8(3), 179-183. https://doi.org/10.1002/adem.200500244
Accelerated testing methodology for lead-free solder interconnects
Grossmann, G. (2005). Accelerated testing methodology for lead-free solder interconnects. In D. Shangguan (Ed.), Lead-Free Solder: Interconnect reliability (pp. 165-179). Materials Park, Ohio: ASM International.
Microstructural investigation of lead-free BGAs soldered with tin-lead solder
Grossmann, G., Tharian, J., Jud, P., & Sennhauser, U. (2005). Microstructural investigation of lead-free BGAs soldered with tin-lead solder. Soldering and Surface Mount Technology, 17(2), 10-21. https://doi.org/10.1108/09540910510597465
Microstructure and deformation behavior of SnAg3.8Cu0.7 lead- free solder
Grossmann, G., Jud, P. P., & Sennhauser, U. (2005). Microstructure and deformation behavior of SnAg3.8Cu0.7 lead- free solder. In R. Aschenbrenner & B. Michel (Eds.), The world of electronic packaging and system integration (pp. 285-291). DDP Goldenbogen.
FIB investigations of local deformation in lead-free solder
Jud, P. P., Grossmann, G., & Sennhauser, U. (2005). FIB investigations of local deformation in lead-free solder (pp. 99-103). Presented at the 3rd Int. conference on materials testing (TEST 2005). Nürnberg, Germany.
Local creep in SnAg3.8Cu0.7 lead-free solder
Jud, P. P., Grossmann, G., Sennhauser, U., & Uggowitzer, P. J. (2005). Local creep in SnAg3.8Cu0.7 lead-free solder. Journal of Electronic Materials, 34(9), 1206-1214. https://doi.org/10.1007/s11664-005-0265-4
Local creep in lead free SnAg3.8Cu0.7 solder
Jud, P. P., Grossmann, G., & Sennhauser, U. (2005). Local creep in lead free SnAg3.8Cu0.7 solder (p. 5 pp.). Presented at the 3rd Int. conference on lead free electronics, sponsored by IPC and Soldertec Global. Barcelona, Spain.
End-of-life impacts of pervasive computing. Are RFID tags a threat to waste management processes?
Kräuchi, P., Wäger, P. A., Eugster, M., Grossmann, G., & Hilty, L. (2005). End-of-life impacts of pervasive computing. Are RFID tags a threat to waste management processes? IEEE Technology and Society Magazine, 24(1), 45-53. https://doi.org/10.1109/MTAS.2005.1407747
Thermomechanische Modellierung von Lötverbindungen mit angepasstem Kriechgesetz bleifreier Lote
Affolter, C., & Grossmann, G. (2003). Thermomechanische Modellierung von Lötverbindungen mit angepasstem Kriechgesetz bleifreier Lote (pp. 821-826). Presented at the 14. DGM-Symposium über Verbundwerkstoffe und Werkstoffverbunde. Vienna, Austria: Wiley-VCH.
Grundlagen des Weichlötens
Grossmann, G. (2002). Grundlagen des Weichlötens (p. 29 pp.). Presented at the Achtes Fachforum Weichlöten. Regensburg, Germany.
No fear of lead-free solder
Grossmann, G., Tharian, J., & Fleischer, W. (2002). No fear of lead-free solder (pp. 303-308). Presented at the 21st Int. conference on electrical contacts (ICEC 2002),. Zürich, Switzerland.
Results of comparative reliability tests on lead-free solder alloys
Grossmann, G., Nicoletti, G., & Solèr, U. (2002). Results of comparative reliability tests on lead-free solder alloys (pp. 1232-1237). Presented at the 52nd Electronic components and technology conference (ECTC 2002). San Diego, CA, USA.