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Draw-spun, photonically annealed Ag fibers as alternative electrodes for flexible CIGS solar cells
Liu, Y., Zeder, S., Lin, S., Carron, R., Grossmann, G., Bolat, S., … Romanyuk, Y. E. (2019). Draw-spun, photonically annealed Ag fibers as alternative electrodes for flexible CIGS solar cells. Science and Technology of Advanced Materials, 20(1), 26-34. https://doi.org/10.1080/14686996.2018.1552480
Grundlagen des Reflowlötens. Teil 4: Konsequenzen der fortlaufenden Miniaturisierung
Bell, H., Grossmann, G., Hippin, C., Lange, B., Wohlrabe, H., & Öttl, H. (2018). Grundlagen des Reflowlötens. Teil 4: Konsequenzen der fortlaufenden Miniaturisierung. Reflow Technologie. Blaubeuren-Seissen: Rehm Thermal Systems GmbH.
Grundlagen des Reflowlötens. Teil 3: Zuverlässigkeit und Fehlermanagement
Bell, H., Grossmann, G., & Wohlrabe, H. (2012). Grundlagen des Reflowlötens. Teil 3: Zuverlässigkeit und Fehlermanagement. Reflow Technologie. Blaubeuren-Seissen: Rehm Thermal Systems GmbH.
Measurement method for the assessment of the energy consumption of cooking setups
Grossmann, G., & Weiss, C. (2011). Measurement method for the assessment of the energy consumption of cooking setups. Journal of Testing and Evaluation, 39(3), 431-435. https://doi.org/10.1520/JTE102997
Fundamentals of Reflow Soldering. Part 1: fundamentals of materials technology in the field of soldering
Bell, H., & Grossmann, G. (2009). Fundamentals of Reflow Soldering. Part 1: fundamentals of materials technology in the field of soldering. Reflow Technology. Blaubeuren-Seissen: Rehm Thermal Systems GmbH.
Local creep in SnAg3.8Cu0.7 lead-free solder
Jud, P. P., Grossmann, G., Sennhauser, U., & Uggowitzer, P. J. (2005). Local creep in SnAg3.8Cu0.7 lead-free solder. Journal of Electronic Materials, 34(9), 1206-1214. https://doi.org/10.1007/s11664-005-0265-4
Magnitude and location of strain in SMT solder joints
Grossmann, G., & Affolter, C. (2000). Magnitude and location of strain in SMT solder joints. In B. Michel, T. Winkler, M. Werner, & H. Fecht (Eds.), MicroMat 2000. Proceedings of the 3rd international conference and poster exhibition on micro materials (pp. 448-451). ddp goldenbogen.