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Draw-spun, photonically annealed Ag fibers as alternative electrodes for flexible CIGS solar cells
Liu, Y., Zeder, S., Lin, S., Carron, R., Grossmann, G., Bolat, S., … Romanyuk, Y. E. (2019). Draw-spun, photonically annealed Ag fibers as alternative electrodes for flexible CIGS solar cells. Science and Technology of Advanced Materials, 20(1), 26-34. https://doi.org/10.1080/14686996.2018.1552480
Grundlagen des Reflowlötens. Teil 4: Konsequenzen der fortlaufenden Miniaturisierung
Bell, H., Grossmann, G., Hippin, C., Lange, B., Wohlrabe, H., & Öttl, H. (2018). Grundlagen des Reflowlötens. Teil 4: Konsequenzen der fortlaufenden Miniaturisierung. Reflow Technologie. Blaubeuren-Seissen: Rehm Thermal Systems GmbH.
Lead free BGAs soldered with SnPb36Ag2 solder
Grossmann, G., & Nicoletti, G. (2015). Lead free BGAs soldered with SnPb36Ag2 solder. Materials Transactions, 56(7), 988-991. https://doi.org/10.2320/matertrans.MI201409
Grundlagen des Reflowlötens. Teil 3: Zuverlässigkeit und Fehlermanagement
Bell, H., Grossmann, G., & Wohlrabe, H. (2012). Grundlagen des Reflowlötens. Teil 3: Zuverlässigkeit und Fehlermanagement. Reflow Technologie. Blaubeuren-Seissen: Rehm Thermal Systems GmbH.
Measurement method for the assessment of the energy consumption of cooking setups
Grossmann, G., & Weiss, C. (2011). Measurement method for the assessment of the energy consumption of cooking setups. Journal of Testing and Evaluation, 39(3), 431-435. https://doi.org/10.1520/JTE102997
The ELFNET book on failure mechanisms, testing methods, and quality issues of lead-free solder interconnects
Grossmann, G., & Zardini, C. (Eds.). (2011). The ELFNET book on failure mechanisms, testing methods, and quality issues of lead-free solder interconnects. https://doi.org/10.1007/978-0-85729-236-0
Fundamentals of Reflow Soldering. Part 1: fundamentals of materials technology in the field of soldering
Bell, H., & Grossmann, G. (2009). Fundamentals of Reflow Soldering. Part 1: fundamentals of materials technology in the field of soldering. Reflow Technology. Blaubeuren-Seissen: Rehm Thermal Systems GmbH.
Исследование микроструктуры паяных соединений бессвинцовых BGA-компонентов, монтированных припоем олово–свинец
Grossmann, G., & Novikov, A. (2008). Исследование микроструктуры паяных соединений бессвинцовых BGA-компонентов, монтированных припоем олово–свинец. Technologies in Electronic Industry (Moscow) (2), 54-60.
Local fatigue in lead-free SnAg3.8Cu0.7 solder
Jud, P. P., Grossmann, G., Sennhauser, U., & Uggowitzer, P. J. (2006). Local fatigue in lead-free SnAg3.8Cu0.7 solder. Advanced Engineering Materials, 8(3), 179-183. https://doi.org/10.1002/adem.200500244
Accelerated testing methodology for lead-free solder interconnects
Grossmann, G. (2005). Accelerated testing methodology for lead-free solder interconnects. In D. Shangguan (Ed.), Lead-free solder. Interconnect reliability (pp. 165-179).
Microstructural investigation of lead-free BGAs soldered with tin-lead solder
Grossmann, G., Tharian, J., Jud, P., & Sennhauser, U. (2005). Microstructural investigation of lead-free BGAs soldered with tin-lead solder. Soldering and Surface Mount Technology, 17(2), 10-21. https://doi.org/10.1108/09540910510597465
Microstructure and deformation behavior of SnAg3.8Cu0.7 lead-free solder
Grossmann, G., Jud, P. P., & Sennhauser, U. (2005). Microstructure and deformation behavior of SnAg3.8Cu0.7 lead-free solder. In B. Michel & R. Aschenbrenner (Eds.), The world of electronic packaging and system integration (pp. 285-291). ddp Goldenbogen.
Local creep in SnAg3.8Cu0.7 lead-free solder
Jud, P. P., Grossmann, G., Sennhauser, U., & Uggowitzer, P. J. (2005). Local creep in SnAg3.8Cu0.7 lead-free solder. Journal of Electronic Materials, 34(9), 1206-1214. https://doi.org/10.1007/s11664-005-0265-4
End-of-life impacts of pervasive computing. Are RFID tags a threat to waste management processes?
Kräuchi, P., Wäger, P. A., Eugster, M., Grossmann, G., & Hilty, L. (2005). End-of-life impacts of pervasive computing. Are RFID tags a threat to waste management processes? IEEE Technology and Society Magazine, 24(1), 45-53. https://doi.org/10.1109/MTAS.2005.1407747
Metallkundliche Grundlagen zur Zuverlässigkeit von Weichlötstellen
Grossmann, G. (1999). Metallkundliche Grundlagen zur Zuverlässigkeit von Weichlötstellen. Produktion von Leiterplatten und Systemen, 1(11), 1642-1648.
The deformation behavior of Sn62Pb36Ag2 and its implications on the design of thermal cycling tests for electronic assemblies
Grossmann, G. (1999). The deformation behavior of Sn62Pb36Ag2 and its implications on the design of thermal cycling tests for electronic assemblies. IEEE Transactions on Electronics Packaging Manufacturing, 22(1), 71-79. https://doi.org/10.1109/6104.755091