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  • (-) Empa Laboratories = 405 Transport at Nanoscale Interfaces
  • (-) Publication Year = 2006 - 2019
  • (-) Empa Authors ≠ Calame, Michel
  • (-) Journal = Acta Materialia
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Engineering the grain boundary network of thin films via ion-irradiation: Towards improved electromigration resistance
Ma, H., La Mattina, F., Shorubalko, I., Spolenak, R., & Seita, M. (2017). Engineering the grain boundary network of thin films via ion-irradiation: Towards improved electromigration resistance. Acta Materialia, 123, 272-284. https://doi.org/10.1016/j.actamat.2016.10.040
Evolution of the microstructure of Sn-Ag-Cu solder joints exposed to ultrasonic waves during solidification
Chinnam, R. K., Fauteux, C., Neuenschwander, J., & Janczak-Rusch, J. (2011). Evolution of the microstructure of Sn-Ag-Cu solder joints exposed to ultrasonic waves during solidification. Acta Materialia, 59(4), 1474-1481. https://doi.org/10.1016/j.actamat.2010.11.011
The effect of surface alloying of Ti powder for vacuum plasma spraying of open porous titanium coatings
Jaeggi, C., Frauchiger, V., Eitel, F., Stiefel, M., Schmotzer, H., & Siegmann, S. (2011). The effect of surface alloying of Ti powder for vacuum plasma spraying of open porous titanium coatings. Acta Materialia, 59(2), 717-725. https://doi.org/10.1016/j.actamat.2010.10.010