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Interface and layer periodicity effects on the thermal conductivity of copper-based nanomultilayers with tungsten, tantalum, and tantalum nitride diffusion barriers
Cancellieri, C., Scott, E. A., Braun, J., King, S. W., Oviedo, R., Jezewski, C., … Hopkins, P. E. (2020). Interface and layer periodicity effects on the thermal conductivity of copper-based nanomultilayers with tungsten, tantalum, and tantalum nitride diffusion barriers. Journal of Applied Physics, 128(19), 195302 (9 pp.). https://doi.org/10.1063/5.0019907