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Solving the critical thermal bowing in 3C-SiC/Si(111) by a tilting Si pillar architecture
Albani, M., Marzegalli, A., Bergamaschini, R., Mauceri, M., Crippa, D., La Via, F., … Miglio, L. (2018). Solving the critical thermal bowing in 3C-SiC/Si(111) by a tilting Si pillar architecture. Journal of Applied Physics, 123(18), 185703 (9 pp.). https://doi.org/10.1063/1.5019325
Electrical properties of Si-Si interfaces obtained by room temperature covalent wafer bonding
Jung, A., Zhang, Y., Arroyo Rojas Dasilva, Y., Isa, F., & von Känel, H. (2018). Electrical properties of Si-Si interfaces obtained by room temperature covalent wafer bonding. Journal of Applied Physics, 123(8), 085701 (5 pp.). https://doi.org/10.1063/1.5020139