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Stress factors in aircraft electronics: superimpositions, case studies and failure precautions
Jacob, P., & Nicoletti, G. (2019). Stress factors in aircraft electronics: superimpositions, case studies and failure precautions. Microelectronics and Reliability, 100-101, 113315 (6 pp.). https://doi.org/10.1016/j.microrel.2019.06.007
A very unusual transistor failure, caused by a solenoid
Jacob, P., & Furrer, R. (2017). A very unusual transistor failure, caused by a solenoid. Microelectronics and Reliability, 76-77, 102-105. https://doi.org/10.1016/j.microrel.2017.06.058
New ESD challenges in RFID manufacturing
Jacob, P., & Thiemann, U. (2017). New ESD challenges in RFID manufacturing. Microelectronics and Reliability, 76-77, 395-399. https://doi.org/10.1016/j.microrel.2017.06.048
Safe cell, safe battery? Battery fire investigation using FMEA, FTA and practical experiments
Held, M., & Brönnimann, R. (2016). Safe cell, safe battery? Battery fire investigation using FMEA, FTA and practical experiments. Microelectronics and Reliability, 64, 705-710. https://doi.org/10.1016/j.microrel.2016.07.051
Early life field failures in modern automotive electronics – an overview; root causes and precautions
Jacob, P. (2016). Early life field failures in modern automotive electronics – an overview; root causes and precautions. Microelectronics and Reliability, 64, 79-83. https://doi.org/10.1016/j.microrel.2016.07.015
Failure mechanisms and precautions in plug connectors and relays
Jacob, P. (2016). Failure mechanisms and precautions in plug connectors and relays. Microelectronics and Reliability, 64, 693-698. https://doi.org/10.1016/j.microrel.2016.07.030
Failure analysis and reliability on system level
Jacob, P. (2015). Failure analysis and reliability on system level. Microelectronics and Reliability, 55(9-10), 2154-2158. https://doi.org/10.1016/j.microrel.2015.06.022
Unusual defects, generated by wafer sawing: an update, including pick&place processing
Jacob, P. (2015). Unusual defects, generated by wafer sawing: an update, including pick&place processing. Microelectronics and Reliability, 55(9-10), 1826-1831. https://doi.org/10.1016/j.microrel.2015.06.124
Failure causes generating aluminium protrusion/extrusion
Jacob, P., & Nicoletti, G. (2013). Failure causes generating aluminium protrusion/extrusion. Microelectronics and Reliability, 53(9-11), 1553-1557. https://doi.org/10.1016/j.microrel.2013.07.015
From component to system failure analysis - the future challenge within work-sharing supply chains
Jacob, P. (2011). From component to system failure analysis - the future challenge within work-sharing supply chains. Microelectronics and Reliability, 51(9-11), 1618-1623. https://doi.org/10.1016/j.microrel.2011.06.066
Comparison and evaluation of newest failure rate prediction models: FIDES and RIAC 217Plus
Held, M., & Fritz, K. (2009). Comparison and evaluation of newest failure rate prediction models: FIDES and RIAC 217Plus. Microelectronics and Reliability, 49(9-11), 967-971. https://doi.org/10.1016/j.microrel.2009.07.031
Reading distance degradation mechanisms of near-field RFID devices
Jacob, P., Knecht, W., Kunz, A., Nicoletti, G., Lautenschlager, T., Mondada, M., & Pachoud, D. (2009). Reading distance degradation mechanisms of near-field RFID devices. Microelectronics and Reliability, 49(9-11), 1288-1292. https://doi.org/10.1016/j.microrel.2009.06.012
Surface ESD (ESDFOS) in assembly fab machineries as a functional and reliability risk - Failure analysis, tool diagnosis and on-site-remedies
Jacob, P. (2008). Surface ESD (ESDFOS) in assembly fab machineries as a functional and reliability risk - Failure analysis, tool diagnosis and on-site-remedies. Microelectronics and Reliability, 48(8-9), 1608-1612. https://doi.org/10.1016/j.microrel.2008.06.021
Unusual defects, generated by wafer sawing: Diagnosis, mechanisms and how to distinguish from related failures
Jacob, P., & Rothkirch, W. (2008). Unusual defects, generated by wafer sawing: Diagnosis, mechanisms and how to distinguish from related failures. Microelectronics and Reliability, 48(8-9), 1253-1257. https://doi.org/10.1016/j.microrel.2008.06.040
Reliability and failure in single crystal silicon MEMS devices
Neels, A., Dommann, A., Schifferle, A., Papes, O., & Mazza, E. (2008). Reliability and failure in single crystal silicon MEMS devices. Microelectronics and Reliability, 48(8-9), 1245-1247. https://doi.org/10.1016/j.microrel.2008.07.018
Device decapsulated (and/or depassivated) - Retest ok - What happened?
Jacob, P., Nicoletti, G., & Hauf, F. (2007). Device decapsulated (and/or depassivated) - Retest ok - What happened? Microelectronics and Reliability, 47(9-11), 1574-1579. https://doi.org/10.1016/j.microrel.2007.07.077
Reliability and wearout characterisation of LEDs
Jacob, P., Kunz, A., & Nicoletti, G. (2006). Reliability and wearout characterisation of LEDs. Microelectronics and Reliability, 46(9-11), 1711-1714. https://doi.org/10.1016/j.microrel.2006.07.048
Electrostatic discharge directly to the chip surface, caused by automatic post-wafer processing
Jacob, P., Thiemann, U., & Reiner, J. C. (2005). Electrostatic discharge directly to the chip surface, caused by automatic post-wafer processing. Microelectronics and Reliability, 45(7-8), 1174-1180. https://doi.org/10.1016/j.microrel.2004.10.012
A laser-based instrument for measuring strain in electronic packages using coherent fibre-bundles
Dias-Lalcaca, P., Hack, E., Visintainer, F., Bernard, S., & Sennhauser, U. (2004). A laser-based instrument for measuring strain in electronic packages using coherent fibre-bundles. Microelectronics and Reliability, 44(9-11), 1693-1697. https://doi.org/10.1016/j.microrel.2004.07.054
Electrostatic effects on semiconductor tools
Jacob, P., & Reiner, J. C. (2004). Electrostatic effects on semiconductor tools. Microelectronics and Reliability, 44(9-11), 1787-1792. https://doi.org/10.1016/j.microrel.2004.07.107