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Thermal stress assessment for transient liquid-phase bonded Si chips in high-power modules using experimental and numerical methods
Lis, A., Kicin, S., Brem, F., & Leinenbach, C. (2017). Thermal stress assessment for transient liquid-phase bonded Si chips in high-power modules using experimental and numerical methods. Journal of Electronic Materials, 46(2), 729-741. https://doi.org/10.1007/s11664-016-5064-6
Thin layer Ag-Sn transient liquid phase bonding using magnetron sputtering for chip to baseplate bonding
Natzke, P., Grossner, U., Janczak-Rusch, J., & Jeurgens, L. (2017). Thin layer Ag-Sn transient liquid phase bonding using magnetron sputtering for chip to baseplate bonding. In 2017 IEEE 5th workshop on wide bandgap power devices and applications (WiPDA) (pp. 165-170). https://doi.org/10.1109/WiPDA.2017.8170541
Effect of process and service conditions on TLP-bonded components with (Ag,Ni–)Sn interlayer combinations
Lis, A., & Leinenbach, C. (2015). Effect of process and service conditions on TLP-bonded components with (Ag,Ni–)Sn interlayer combinations. Journal of Electronic Materials, 44(11), 4576-4588. https://doi.org/10.1007/s11664-015-3982-3