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Large-scale anodic bonding mediated by a liquid tin solder
Claure Ramirez, E., Klemenčič, R., Klučka, M., Lang, B., Beisel, S., Altorfer, H., … Malfait, W. J. (2017). Large-scale anodic bonding mediated by a liquid tin solder. Journal of Materials Processing Technology, 246, 69-76. https://doi.org/10.1016/j.jmatprotec.2017.03.006
Optimized solder alloy for glass-to-metal joints by simultaneous soldering and anodic bonding
Malfait, W. J., Klemenčič, R., Lang, B., Rist, T., Klučka, M., Zajacz, Z., & Koebel, M. M. (2016). Optimized solder alloy for glass-to-metal joints by simultaneous soldering and anodic bonding. Journal of Materials Processing Technology, 236, 176-182. https://doi.org/10.1016/j.jmatprotec.2016.05.017
Anodic bonding of activated tin solder alloys in the liquid state: a novel large-area hermetic glass sealing method
Koebel, M. M., El Hawi, N., Lu, J., Gattiker, F., & Neuenschwander, J. (2011). Anodic bonding of activated tin solder alloys in the liquid state: a novel large-area hermetic glass sealing method. Solar Energy Materials and Solar Cells, 95(11), 3001-3008. https://doi.org/10.1016/j.solmat.2011.06.012