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Microstructural investigation of lead-free BGAs soldered with tin-lead solder
Grossmann, G., Tharian, J., Jud, P., & Sennhauser, U. (2005). Microstructural investigation of lead-free BGAs soldered with tin-lead solder.
Soldering and Surface Mount Technology
,
17
(2), 10-21. https://doi.org/10.1108/09540910510597465
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