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Covalent S-O bonding enables enhanced photoelectrochemical performance of Cu<sub>2</sub>S/Fe<sub>2</sub>O<sub>3</sub> heterojunction for water splitting
Zhang, Y., Huang, Y., Zhu, S. ‐S., Liu, Y. ‐Y., Zhang, X., Wang, J. ‐J., & Braun, A. (2021). Covalent S-O bonding enables enhanced photoelectrochemical performance of Cu2S/Fe2O3 heterojunction for water splitting. Small, 17(30), 2100320 (9 pp.). https://doi.org/10.1002/smll.202100320