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Effect of process and service conditions on TLP-bonded components with (Ag,Ni–)Sn interlayer combinations
Lis, A., & Leinenbach, C. (2015). Effect of process and service conditions on TLP-bonded components with (Ag,Ni–)Sn interlayer combinations.
Journal of Electronic Materials
,
44
(11), 4576-4588. https://doi.org/10.1007/s11664-015-3982-3
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