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Anodic bonding of activated tin solder alloys in the liquid state: a novel large-area hermetic glass sealing method
Koebel, M. M., El Hawi, N., Lu, J., Gattiker, F., & Neuenschwander, J. (2011). Anodic bonding of activated tin solder alloys in the liquid state: a novel large-area hermetic glass sealing method. Solar Energy Materials and Solar Cells, 95(11), 3001-3008. https://doi.org/10.1016/j.solmat.2011.06.012