| Joining with reactive nano-multilayers: influence of thermal properties of components on joint microstructure and mechanical performance
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| Ceramic protection plates brazed to aluminum brake discs
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| Reactive phase formation and isothermal solidification in the Ni/Au-18.6Si/Ni layer system
Leinenbach, C., Weyrich, N., Stacher, M., & Richter, K. W. (2016). Reactive phase formation and isothermal solidification in the Ni/Au-18.6Si/Ni layer system. Journal of Alloys and Compounds, 687, 7-16. https://doi.org/10.1016/j.jallcom.2016.06.102 |
| Optimized solder alloy for glass-to-metal joints by simultaneous soldering and anodic bonding
Malfait, W. J., Klemenčič, R., Lang, B., Rist, T., Klučka, M., Zajacz, Z., & Koebel, M. M. (2016). Optimized solder alloy for glass-to-metal joints by simultaneous soldering and anodic bonding. Journal of Materials Processing Technology, 236, 176-182. https://doi.org/10.1016/j.jmatprotec.2016.05.017 |
| Joining of Cu, Ni, and Ti using Au-Ge-based high-temperature solder alloys
Weyrich, N., Jin, S., Duarte, L. I., & Leinenbach, C. (2014). Joining of Cu, Ni, and Ti using Au-Ge-based high-temperature solder alloys. Journal of Materials Engineering and Performance, 23(5), 1585-1592. https://doi.org/10.1007/s11665-014-0864-4 |
| Nanomechanical responses of intermetallic phase at the solder joint interface - crystal orientation and metallurgical effects
Song, J. M., Huang, B. R., Liu, C. Y., Lai, Y. S., Chiu, Y. T., & Huang, T. W. (2012). Nanomechanical responses of intermetallic phase at the solder joint interface - crystal orientation and metallurgical effects. Materials Science and Engineering A: Structural Materials: Properties, Microstructure and Processing, 534, 53-59. https://doi.org/10.1016/j.msea.2011.11.037 |
| Evolution of the microstructure of Sn-Ag-Cu solder joints exposed to ultrasonic waves during solidification
Chinnam, R. K., Fauteux, C., Neuenschwander, J., & Janczak-Rusch, J. (2011). Evolution of the microstructure of Sn-Ag-Cu solder joints exposed to ultrasonic waves during solidification. Acta Materialia, 59(4), 1474-1481. https://doi.org/10.1016/j.actamat.2010.11.011 |
| Wetting and soldering behavior of eutectic Au-Ge alloy on Cu and Ni substrates
Leinenbach, C., Valenza, F., Giuranno, D., Elsener, H. R., Jin, S., & Novakovic, R. (2011). Wetting and soldering behavior of eutectic Au-Ge alloy on Cu and Ni substrates. Journal of Electronic Materials, 40(7), 1533-1541. https://doi.org/10.1007/s11664-011-1639-4 |
| Microstructural investigation of lead-free BGAs soldered with tin-lead solder
Grossmann, G., Tharian, J., Jud, P., & Sennhauser, U. (2005). Microstructural investigation of lead-free BGAs soldered with tin-lead solder. Soldering and Surface Mount Technology, 17(2), 10-21. https://doi.org/10.1108/09540910510597465 |
